Crack‐Growing Interlayer Design for Deep Crack Propagation and Ultrahigh Sensitivity Strain Sensing
Author
Minho Kim, Taewi Kim, Jieun Park, Insic Hong, Myungrae Hong, Seonggyeong Park, Beomjin Kim, Sehyuk Ahn, Siwoo Jang, Seungyong Han, Je‐Sung Koh, Daeshik Kang
